- Rigid PCB[10]
- Single-Sided PCB[10]
- Double-Sided PCB[10]
- Multilayer PCB[9]
- Insulation Materials & Elements[10]
- Contact Person : Ms. Xian Zara
- Company Name : Zhuhai Sanny Co., Ltd.
- Tel : 86-756-3236181-601
- Fax : 86-756-3236182
- Address : Guangdong,Zhuhai,No.1164, Jiuzhou Road East, Jida
- Country/Region : China
- Zip : 519015
Aluminum base copper clad laminate board(SY-03)
Item | Test Condition | INDEX | ||
SY-01 | SY-02 | SY-03 | ||
Thermal Conductivity (W/m.k) | A | 1~1.5 | 1.5~2.0 | 2.0~3.0 |
Peel Strength (N/mm) | A After thermal stress | ≥1.8 | ≥1.8 | ≥1.8 |
Blister Test after Thermal Stress | A After thermal impact | 260°C2min | 288°C 2min | 300°C 2min |
Flammability | UL94 | V-0 | V-0 | V-0 |
Thermal Resistance Max(°C/W) | A | ≤1.2 | ≤1.0 | ≤0.75 |
Surface Resistivity (MΩ.m) | A Constant humidity treatment (90%, 35 °C,96H) | ≥1×105 | ≥1×105 | ≥1×106 |
Volume Resistivity (MΩ.m) | A (90%,35 °C,96H) | ≥1.8×106 | ≥1.8×106 | ≥1.8×107 |
Dielectric Breakdown Min (KV) | A | ≥2.0 | ≥2.5 | ≥3.0 |
Dielectic Constant (1MHz) | (40 °C,90%,96H) | ≤4.4 | ≤3 | ≤2.5 |
Dissipation Factor | (40 °C,90%,96H) | ≤0.03 | ≤0.03 | ≤0.03 |
MBCCL Aluminum base copper clad laminated board
SY-03
AL grade: 1060,3003,5052
thickness:0.8mm,1.0mm,1.2mm.1.6mm.2.0mm.3.0mm
copper thickness:1oz, 2oz, 4oz
size: 500*600mm
IMS Aluminum base copper clad laminated sheet
Aluminum base copper clad laminate board(SY-03)
