1high power aluminum clad pcb board
2.al: 1.6MM copper foil 1oz
3.thermal conductivity 2.5w/mk
4.HASL(Pb free)
NO. | ITEM | INDEX | 01 | Surface treatment | HAL(lead free), Immersion Gold, OSP | 02 | Layer | Single-sided, double-sided, multilayer and special structure layer | 03 | Max size | 1200mm*600mm | 04 | PCB thickness | 0.5-3.3mm | 05 | Copper foil thickness | H 1 2 3 4 5 6 10(OZ) | 06 | Insulating layer thickness | 50 75 100 125 150 micron | 07 | Metal base type | Aluminum,Ferrum,Copper,Stainless steel | 08 | Metal base thickness | 0.5 0.8 1.0 1.2 1.5 2.0 3.0 3.2 (mm) | 09 | Shaping | Die Punching, CNC Route, CNC V-Cut | 10 | Testing | 100% Compute Short/Open Circuit Test | 11 | The Minimum Hole Diameter | single-sided 0.8mm, PTH 0.3mm | 12 | The Minimum Pad Size | 1.2mm | 13 | The Minimum PTH Distance | 2.0mm | 14 | The Minimum Line Width | 0.1mm | 15 | The Minimum Increase of Solder Mask | 0.15mm | 16 | The Minimum Pad | 10um | 17 | Solder Mask Color | green, white, black, red, yellow | 18 | The Minimum Letter Width | 0.15mm | 19 | The Minimum Letter Height | 0.8mm | 20 | Letter Color | white, black, blue, yellow, red |
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1high power aluminum clad pcb board
2.aluminum base: 0.8-3.0MM(1100,3003,5052,6061)3.thermal conductivity 1.5-3.0w/mk4.osp,HASL(Pb free), immersion gold,flash gold
aluminum clad pcb board
